HYBMAN

2018

1. 3D Printed structural electronics: embedding and connecting electronic components into freeform electronic devices

   H.H. Maalderink, F.B.J. Bruning, M.R. Schipper, J.J. van der Werff, W.C. Germs, J.J.C. Remmers, and E.R. Meinders

   Plastics, Rubber and Composites, Macromolecular Engineering, 2018

   DOI Bib

   @article{Maalderink2018,
     author = {Maalderink, H.H. and Bruning, F.B.J. and de Schipper, M.R. and {van der Werff}, J.J. and Germs, W.C. and Remmers, J.J.C. and Meinders, E.R.},
     title = {3D Printed structural electronics: embedding and connecting electronic components into freeform electronic devices},
     journal = {Plastics, Rubber and Composites, Macromolecular Engineering},
     volume = {47},
     pages = {35--41},
     year = {2018},
     doi = {10.1080/14658011.2017.1418165}
   }